US 11,742,697 B1
Inductive module and device
Yu-Ting Cheng, Hsinchu (TW); Jui-Yu Hsu, Hsinchu (TW); Chung-Yu Wu, Hsinchu (TW); and Ming-Dou Ker, Zhubei (TW)
Assigned to National Yang Ming Chiao Tung University, Hsinchu (TW)
Filed by National Yang Ming Chiao Tung University, Hsinchu (TW)
Filed on Aug. 10, 2022, as Appl. No. 17/884,927.
Claims priority of application No. 111106321 (TW), filed on Feb. 22, 2022.
Int. Cl. H02J 50/00 (2016.01); H01Q 15/00 (2006.01); H02J 50/10 (2016.01); A61N 1/378 (2006.01)
CPC H02J 50/005 (2020.01) [H01Q 15/0086 (2013.01); H02J 50/10 (2016.02); A61N 1/3787 (2013.01)] 16 Claims
OG exemplary drawing
 
1. An inductive module with a miniaturized metamaterial structure, comprising:
an insulating substrate that has a first surface and a second surface opposite
to said first surface, and a through hole extending between said first surface and said second surface;
two coil units, which are respectively disposed on said first surface and said second surface of said insulating substrate, and electrically connected to each other through said through hole, each of said coil units including at least one closed loop coil; and
at least one magnetic unit that corresponds in position to a portion at least one of said coil units, that surrounds said portion of said at least one of said coil units, and that has an opening.