US 11,742,565 B2
Semiconductor devices and methods of manufacturing semiconductor devices
Kyoung Yeon Lee, Incheon (KR); Tae Yong Lee, Gyeonggi-do (KR); Doo Soub Shin, Incheon (KR); Seon A Lee, Incheon (KR); Woo Bin Jung, Seoul (KR); Ji Yeon Ryu, Incheon (KR); and Jin Young Khim, Seoul (KR)
Assigned to Amkor Technology Singapore Holding Pte. Ltd., Singapore (SG)
Filed by Amkor Technology Singapore Holding Pte. Ltd., Singapore (SG)
Filed on Aug. 18, 2021, as Appl. No. 17/405,951.
Application 17/405,951 is a continuation of application No. 16/590,801, filed on Oct. 2, 2019, granted, now 11,101,540.
Prior Publication US 2021/0376451 A1, Dec. 2, 2021
Int. Cl. H01Q 1/22 (2006.01); H01L 23/00 (2006.01); H01L 23/66 (2006.01); H01L 23/31 (2006.01); H01L 23/552 (2006.01); H01L 25/16 (2023.01); H01L 21/683 (2006.01); H01L 21/56 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01Q 1/50 (2006.01); H01Q 21/24 (2006.01)
CPC H01Q 1/2283 (2013.01) [H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01L 24/08 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 25/16 (2013.01); H01Q 1/50 (2013.01); H01Q 21/24 (2013.01); H01L 2221/68359 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/08237 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/80006 (2013.01); H01L 2924/19102 (2013.01); H01L 2924/3025 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a substrate comprising:
a substrate top side;
a substrate bottom side;
a substrate dielectric structure between the substrate top side and the substrate bottom side; and
a substrate conductive structure traversing the substrate dielectric structure and comprising:
a first substrate terminal; and
a second substrate terminal at the substrate top side;
an electronic component coupled to the substrate and comprising:
a component terminal coupled to the first substrate terminal; and
a first antenna element coupled to the substrate and comprising:
a first element head side;
a first element dielectric structure;
a first element conductive structure comprising a first element terminal and contacting the first element dielectric structure; and
a first antenna pattern at the first element head side and grouped with the first element terminal and the first element conductive structure;
wherein:
the first antenna element is coupled to the substrate outside a footprint of the electronic component; and
the first element terminal is coupled to the second substrate terminal; and
wherein:
the first element head side comprises a lateral side of the first antenna element; and
the first antenna pattern is on the lateral side of the first antenna element and is configured to radiate in a lateral direction perpendicular to the lateral side of the first antenna element.