US 11,742,437 B2
WLCSP with transparent substrate and method of manufacturing the same
David Gani, Choa Chu Kang (SG); and Yiying Kuo, Taoyuan (TW)
Assigned to STMICROELECTRONICS LTD, Kowloon (HK); and STMICROELECTRONICS PTE LTD, Singapore (SG)
Filed by STMICROELECTRONICS LTD, Kowloon (HK); and STMICROELECTRONICS PTE LTD, Singapore (SG)
Filed on Feb. 26, 2021, as Appl. No. 17/187,510.
Claims priority of provisional application 63/001,004, filed on Mar. 27, 2020.
Prior Publication US 2021/0305438 A1, Sep. 30, 2021
Int. Cl. H01L 31/0203 (2014.01); H01L 31/18 (2006.01); H01L 31/0392 (2006.01); H01L 31/02 (2006.01); H01L 21/78 (2006.01)
CPC H01L 31/0203 (2013.01) [H01L 21/78 (2013.01); H01L 31/02002 (2013.01); H01L 31/02005 (2013.01); H01L 31/0392 (2013.01); H01L 31/1876 (2013.01); H01L 31/1896 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A device, comprising:
a transparent substrate including a first surface, a second surface opposite to the first surface in a direction directed from the first surface towards the second surface, and sidewalls transverse to the first surface and the second surface;
a molding compound on the sidewalls of the transparent substrate;
a die on the second surface of the transparent substrate, the die including:
a sensor aligned with the transparent substrate;
a contact that extends outward from an edge of the die and away from the sensor in a transverse direction transverse to the direction; and
an electrical connection having a first end coupled to the sensor and a second end coupled to the contact;
a first insulating layer on the die and on the contact of the die; and
a conductive layer on the first insulating layer, the conductive layer including:
a first end portion on the first insulating layer; and
a transverse portion on the first insulating layer, the transverse portion is transverse to the first end portion, is transverse to the contact, and is coupled to the contact.