US 11,742,300 B2
Semiconductor devices and methods of manufacturing semiconductor devices
Ji Hoon Oh, Gyeonggi-do (KR); Dong Hyun Bang, Incheon (KR); Soo Jin Shin, Gyeonggi-do (KR); Young Ik Kwon, Taichung (TW); Tae Kyeong Hwang, Seoul (KR); Min Jae Lee, Chandler, AZ (US); and Min Jae Kong, Seoul (KR)
Assigned to Amkor Technology Singapore Holding Pte. Ltd., Singapore (SG)
Filed by Amkor Technology Singapore Holding Pte. Ltd., Singapore (SG)
Filed on Jun. 7, 2022, as Appl. No. 17/833,957.
Application 17/833,957 is a continuation of application No. 17/002,607, filed on Aug. 25, 2020, granted, now 11,355,451, issued on Jun. 7, 2022.
Application 17/002,607 is a continuation in part of application No. 16/553,986, filed on Aug. 28, 2019, granted, now 11,004,801, issued on May 11, 2021.
Prior Publication US 2022/0302044 A1, Sep. 22, 2022
Int. Cl. H01L 23/00 (2006.01); H01L 23/552 (2006.01); H01L 23/31 (2006.01); H01L 23/66 (2006.01); H01Q 1/22 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 25/10 (2006.01)
CPC H01L 23/552 (2013.01) [H01L 21/561 (2013.01); H01L 21/78 (2013.01); H01L 23/3128 (2013.01); H01L 23/66 (2013.01); H01L 25/105 (2013.01); H01Q 1/2283 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method to manufacture a semiconductor device, comprising:
placing a first electronic component on a top side of a substrate;
placing a second electronic component on the top side of the substrate;
providing an encapsulant on the top side of the substrate, contacting a lateral side of the second electronic component;
providing a cover over the first electronic component to define a first compartment containing the first electronic component;
providing a conformal shield over the second electronic component to define a second compartment containing the second electronic component; and
removing the cover from the first compartment, wherein the first electronic component is unshielded, and the second electronic component is shielded by the conformal shield.