CPC H01L 23/552 (2013.01) [H01L 21/561 (2013.01); H01L 21/78 (2013.01); H01L 23/3128 (2013.01); H01L 23/66 (2013.01); H01L 25/105 (2013.01); H01Q 1/2283 (2013.01)] | 20 Claims |
1. A method to manufacture a semiconductor device, comprising:
placing a first electronic component on a top side of a substrate;
placing a second electronic component on the top side of the substrate;
providing an encapsulant on the top side of the substrate, contacting a lateral side of the second electronic component;
providing a cover over the first electronic component to define a first compartment containing the first electronic component;
providing a conformal shield over the second electronic component to define a second compartment containing the second electronic component; and
removing the cover from the first compartment, wherein the first electronic component is unshielded, and the second electronic component is shielded by the conformal shield.
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