US 11,742,294 B2
Interposers and semiconductor packages including the same
Jongho Park, Cheonan-si (KR); Seunghwan Kim, Anyang-si (KR); Junyoung Oh, Seoul (KR); Yonghyun Kim, Asan-si (KR); Yongkwan Lee, Hwaseong-si (KR); and Junga Lee, Cheonan-si (KR)
Assigned to Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on May 3, 2021, as Appl. No. 17/306,290.
Claims priority of application No. 10-2020-0122434 (KR), filed on Sep. 22, 2020.
Prior Publication US 2022/0093519 A1, Mar. 24, 2022
Int. Cl. H01L 23/13 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 25/10 (2006.01); H01L 23/31 (2006.01)
CPC H01L 23/5385 (2013.01) [H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 23/5386 (2013.01); H01L 24/16 (2013.01); H01L 24/73 (2013.01); H01L 25/105 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/73204 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1041 (2013.01); H01L 2225/1058 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor package, comprising:
a first package substrate;
a first semiconductor chip on the first package substrate;
a first conductive connector on the first package substrate; and
an interposer, the interposer including
a central portion on the first semiconductor chip, and
an outer portion contacting the first conductive connector,
wherein the central portion of the interposer includes a bottom surface facing the first semiconductor chip, the bottom surface defining a recess from a bottom surface of the outer portion of the interposer in a vertical direction that is perpendicular to a top surface of the first package substrate,
a thickness in the vertical direction of the outer portion of the interposer is greater than a thickness in the vertical direction of the central portion of the interposer, and
wherein the central portion protrudes upwardly from the outer portion, so that a top surface of the outer portion is at a lower level than a top surface of the central portion in the vertical direction.