CPC H01L 23/5385 (2013.01) [H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 23/5386 (2013.01); H01L 24/16 (2013.01); H01L 24/73 (2013.01); H01L 25/105 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/73204 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1041 (2013.01); H01L 2225/1058 (2013.01)] | 20 Claims |
1. A semiconductor package, comprising:
a first package substrate;
a first semiconductor chip on the first package substrate;
a first conductive connector on the first package substrate; and
an interposer, the interposer including
a central portion on the first semiconductor chip, and
an outer portion contacting the first conductive connector,
wherein the central portion of the interposer includes a bottom surface facing the first semiconductor chip, the bottom surface defining a recess from a bottom surface of the outer portion of the interposer in a vertical direction that is perpendicular to a top surface of the first package substrate,
a thickness in the vertical direction of the outer portion of the interposer is greater than a thickness in the vertical direction of the central portion of the interposer, and
wherein the central portion protrudes upwardly from the outer portion, so that a top surface of the outer portion is at a lower level than a top surface of the central portion in the vertical direction.
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