CPC H01L 23/5226 (2013.01) [H01L 21/76843 (2013.01); H01L 21/76847 (2013.01); H01L 21/76877 (2013.01); H10B 43/27 (2023.02); H01L 23/53209 (2013.01); H01L 23/53266 (2013.01)] | 15 Claims |
1. An integrated assembly comprising a conductive interconnect extending upwardly from a conductive structure; the conductive interconnect including:
a first conductive material configured as an upwardly-opening container shape having two inner sidewalls surfaces and a base surface extending between the two inner sidewall surfaces, the first conductive material comprising cobalt;
a second conductive material within an interior region along the two inner sidewall surfaces and across the base surface of the upwardly-opening container shape; the first and second conductive materials each consisting of two or more of W, Co and Ni and primarily comprising a same metal as one another and differing from one another in average grain size, the second conductive material having a smaller average grain size relative to an average grain size of the first conductive material; and
a liner between the first conductive material and the second conductive material, the liner comprising metal silicide.
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