US 11,742,272 B2
Semiconductor device
Yoichi Nishihara, Nagano (JP)
Assigned to SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed by SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed on Nov. 26, 2021, as Appl. No. 17/456,612.
Claims priority of application No. 2020-217444 (JP), filed on Dec. 25, 2020.
Prior Publication US 2022/0208668 A1, Jun. 30, 2022
Int. Cl. H01L 23/498 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/49822 (2013.01) [H01L 24/32 (2013.01); H01L 2224/32225 (2013.01); H01L 2924/3511 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A semiconductor device comprising:
a film substrate;
an adhesive on a first surface of the film substrate;
an electronic component on the adhesive;
a wiring layer on a second surface of the film substrate opposite from the first surface, the wiring layer being connected to the electronic component through a via hole piercing through the film substrate and the adhesive; and
a reinforcement member in an area around the electronic component on the adhesive, the reinforcement member having a thickness smaller than a thickness of the electronic component.