US 11,742,265 B2
Exposed heat-generating devices
Hung-Yu Chou, Taipei (TW); Chi-Chen Chien, New Taipei (TW); Yuh-Harng Chien, New Taipei (TW); Steven Alfred Kummerl, Carrollton, TX (US); Bo-Hsun Pan, Taoyuan (TW); and Fu-Hua Yu, New Taipei (TW)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed on Oct. 22, 2019, as Appl. No. 16/660,713.
Prior Publication US 2021/0118779 A1, Apr. 22, 2021
Int. Cl. H01L 23/495 (2006.01); H01L 21/56 (2006.01); H01L 21/48 (2006.01); H01L 23/522 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01)
CPC H01L 23/49568 (2013.01) [H01L 21/4839 (2013.01); H01L 21/565 (2013.01); H01L 23/3157 (2013.01); H01L 23/49548 (2013.01); H01L 23/49861 (2013.01); H01L 23/5228 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A semiconductor package, comprising: a lead frame including: a first row of leads; a first pad coupled to the first row of leads; a second row of leads; and a second pad coupled to the second row of leads, the first and second pads separated by a gap; and
a heat-generating device coupled to the first and second pads and exposed to a top surface of the semiconductor package.