CPC H01L 23/49568 (2013.01) [H01L 21/4839 (2013.01); H01L 21/565 (2013.01); H01L 23/3157 (2013.01); H01L 23/49548 (2013.01); H01L 23/49861 (2013.01); H01L 23/5228 (2013.01)] | 16 Claims |
1. A semiconductor package, comprising: a lead frame including: a first row of leads; a first pad coupled to the first row of leads; a second row of leads; and a second pad coupled to the second row of leads, the first and second pads separated by a gap; and
a heat-generating device coupled to the first and second pads and exposed to a top surface of the semiconductor package.
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