US 11,742,258 B2
Thermally conductive sheet and method for manufacturing thermally conductive sheet
Yuma Sato, Shimotsuke (JP); Keisuke Aramaki, Shimotsuke (JP); and Yusuke Kubo, Shimotsuke (JP)
Assigned to DEXERIALS CORPORATION, Shimotsuke (JP)
Appl. No. 17/617,238
Filed by DEXERIALS CORPORATION, Shimotsuke (JP)
PCT Filed Apr. 23, 2021, PCT No. PCT/JP2021/016492
§ 371(c)(1), (2) Date Dec. 7, 2021,
PCT Pub. No. WO2021/230047, PCT Pub. Date Nov. 18, 2021.
Claims priority of application No. 2020-086074 (JP), filed on May 15, 2020; and application No. 2020-149489 (JP), filed on Sep. 4, 2020.
Prior Publication US 2022/0262702 A1, Aug. 18, 2022
Int. Cl. C08J 5/18 (2006.01); H01L 23/373 (2006.01); B29C 48/00 (2019.01); C08J 5/04 (2006.01); C08K 3/22 (2006.01); C08K 3/28 (2006.01); C08K 3/38 (2006.01); C08K 7/18 (2006.01); B29K 101/10 (2006.01); B29K 101/12 (2006.01); B29K 509/04 (2006.01); B82Y 30/00 (2011.01)
CPC H01L 23/3737 (2013.01) [B29C 48/0021 (2019.02); B29C 48/022 (2019.02); C08J 5/042 (2013.01); C08J 5/18 (2013.01); C08K 3/22 (2013.01); C08K 3/28 (2013.01); C08K 3/38 (2013.01); C08K 7/18 (2013.01); B29K 2101/10 (2013.01); B29K 2101/12 (2013.01); B29K 2509/04 (2013.01); B29K 2995/0013 (2013.01); B29K 2995/0094 (2013.01); B82Y 30/00 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/282 (2013.01); C08K 2003/385 (2013.01); C08K 2201/001 (2013.01); C08K 2201/005 (2013.01)] 9 Claims
 
1. A thermally conductive sheet containing: a binder resin; a first thermally conductive filler which is a scaly boron nitride; and a second thermally conductive filler comprising a non-scaly and non-fibrous thermally conductive filler, the first thermally conductive filler and the second thermally conductive filler being dispersed in the binder resin,
wherein relative permittivity and thermal conductivity in the thickness direction of the thermally conductive sheet and relative permittivity and thermal conductivity in the surface direction of the thermally conductive sheet are different,
wherein the thermally conductive sheet contains no carbon fibers,
wherein the binder resin comprises a two-part addition reaction type silicone resin prepared by curing a silicone having an alkenyl group as a main component with a curing agent having a hydrosilyl group,
wherein the first thermally conductive filler is oriented in the thickness direction of the thermally conductive sheet,
wherein a content of the first thermally conductive filler is 20 to 35% by volume, and
wherein the second thermally conductive filler comprises aluminum nitride particles and spherical alumina particles, and at least one of (i) a content of the spherical alumina particles is 10 to 25% by volume and (ii) a content of the aluminum nitride particles is 10 to 25% by volume.