US 11,742,254 B2
Sensor package and method
Tsung-Hsien Chiang, Hsinchu (TW); Yu-Chih Huang, Hsinchu (TW); Ting-Ting Kuo, Hsinchu (TW); Chih-Hsuan Tai, Taipei (TW); Ban-Li Wu, Hsinchu (TW); Ying-Cheng Tseng, Tainan (TW); Chi-Hui Lai, Taichung (TW); Chiahung Liu, Hsinchu (TW); Hao-Yi Tsai, Hsinchu (TW); Chung-Shi Liu, Hsinchu (TW); and Chen-Hua Yu, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Nov. 9, 2020, as Appl. No. 17/92,543.
Application 17/092,543 is a division of application No. 16/266,276, filed on Feb. 4, 2019, granted, now 10,832,985.
Claims priority of provisional application 62/737,282, filed on Sep. 27, 2018.
Prior Publication US 2021/0057302 A1, Feb. 25, 2021
Int. Cl. H01L 23/31 (2006.01); H01L 23/528 (2006.01); H01L 23/522 (2006.01); H01L 21/56 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/3171 (2013.01) [H01L 21/565 (2013.01); H01L 21/76837 (2013.01); H01L 23/528 (2013.01); H01L 23/5226 (2013.01); H01L 24/09 (2013.01); H01L 2224/02373 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A device comprising:
a sensor die having a first surface and a second surface opposite the first surface, the sensor die having an input/output region and a first sensing region at the first surface;
an encapsulant at least laterally encapsulating the sensor die, the encapsulant having a topmost surface, a bottommost surface, and a curved surface, the curved surface extending from the bottommost surface of the encapsulant to a sidewall of the sensor die;
a conductive via extending through the encapsulant, wherein a same continuous material of the encapsulant extends continuously between a sidewall of the conductive via and a first portion of the sidewall of the sensor die; and
a front-side redistribution structure on the first surface of the sensor die and the topmost surface of the encapsulant, the front-side redistribution structure being connected to the conductive via and the sensor die, the front-side redistribution structure covering the input/output region of the sensor die, the front-side redistribution structure having a first opening exposing the first sensing region of the sensor die.