CPC H01L 23/04 (2013.01) [H01L 23/049 (2013.01); H01L 23/3114 (2013.01); H01L 23/49838 (2013.01); H01L 24/48 (2013.01); H01L 25/162 (2013.01); H01R 12/585 (2013.01); H01R 12/7064 (2013.01); H01L 2224/48091 (2013.01)] | 11 Claims |
1. A power semiconductor device comprising:
a power semiconductor element;
a control circuit that controls the power semiconductor element;
a control substrate having the control circuit mounted thereon;
a lid arranged to overlap with at least a portion of the control substrate in a first direction;
at least one external connection terminal having a first portion connected with the control substrate, a second portion to be connected with an external apparatus, and a third portion located between the first portion and the second portion and fixed to the lid, the first portion being constituted as a press-fit portion;
a case arranged to surround the power semiconductor element, the control circuit, and the control substrate, and constituting at least a portion of an outer frame of the power semiconductor device together with the lid; and
a sealing resin that seals the power semiconductor element within the case, wherein
the first portion includes an end portion protruding from a surface of the control substrate facing the power semiconductor element, and
the lid and the at least one external connection terminal are integrally formed as one member.
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