US 11,742,226 B2
Substrate liquid processing apparatus
Takahiko Otsu, Kumamoto (JP); Kazuya Koyama, Kumamoto (JP); and Takao Inada, Kumamoto (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Dec. 26, 2019, as Appl. No. 16/727,007.
Claims priority of application No. 2018-245424 (JP), filed on Dec. 27, 2018.
Prior Publication US 2020/0211865 A1, Jul. 2, 2020
Int. Cl. B05B 12/14 (2006.01); H01L 21/67 (2006.01); B08B 3/04 (2006.01)
CPC H01L 21/6715 (2013.01) [B05B 12/1409 (2013.01); B08B 3/048 (2013.01); H01L 21/67023 (2013.01); H01L 21/67028 (2013.01); H01L 21/67051 (2013.01); H01L 21/67057 (2013.01); H01L 21/67086 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A substrate processing apparatus comprising:
a processing tank configured to store a processing liquid for performing a liquid processing and including a first side wall;
an outer tank formed to accommodate the processing tank therewithin and configured to store the processing liquid overflowing from the processing tank, the outer tank having a bottom wall positioned below a bottom wall of the processing tank;
a substrate lifter including a support plate extending in a vertical direction and a substrate support connected to the support plate and configured to support a plurality of substrates such that main surfaces of each of the plurality of substrates follow the vertical direction in the processing tank; and
a processing liquid ejector provided below the substrate lifter and configured to eject the processing liquid into the processing tank to generate an ascending flow of the processing liquid in the processing tank;
wherein the first side wall of the processing tank includes a first discharge hole configured to adjust the ascending flow of the processing liquid ejected by the processing liquid ejector in a side space formed between the first side wall of the processing tank and a first substrate among the plurality of substrates when the plurality of substrates are disposed on the substrate support, by discharging the processing liquid from the processing tank into the outer tank, and
the support plate has a third discharge hole configured to adjust flow of the processing liquid in a second side space formed between the support plate and a last substrate among the plurality of substrates when the plurality of substrates are disposed on the substrate support, and when the processing liquid is ejected by the processing liquid ejector the third discharge hole is aligned with the first discharge hole in a horizontal direction and positioned below upper ends of the plurality of substrates when the plurality of substrates are disposed on the substrate support.