US 11,742,224 B2
Substrate chuck and substrate bonding system including the same
Youngbin Choi, Suwon-si (KR); and Heebok Kang, Hwaseong-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD.
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Mar. 2, 2021, as Appl. No. 17/189,941.
Application 17/189,941 is a continuation of application No. 15/203,486, filed on Jul. 6, 2016, granted, now 10,964,560.
Claims priority of application No. 10-2015-0183959 (KR), filed on Dec. 22, 2015.
Prior Publication US 2021/0183667 A1, Jun. 17, 2021
Int. Cl. H01L 21/67 (2006.01); H01L 21/687 (2006.01); H01L 21/683 (2006.01)
CPC H01L 21/67092 (2013.01) [H01L 21/6838 (2013.01); H01L 21/6875 (2013.01); H01L 21/68735 (2013.01); H01L 21/68742 (2013.01); H01L 21/68785 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A method comprising:
mounting a first wafer on a first chuck;
mounting a second wafer on a second chuck;
cleaning the first wafer and the second wafer;
bonding the second wafer on the first wafer; and
performing a heat treatment process on the first wafer and the second wafer,
wherein the first chuck comprises a first base having a first region and a second region circumferentially surrounding the first region, a plurality of first lift holes passing through the first base first region, a plurality of first lift guard rings on the first base and surrounding the plurality of first lift holes, a plurality of first support pins extending outwardly from the first region of the base, wherein the plurality of first support pins have upper surfaces at a first level, and a plurality of second support pins extending outwardly from the second region of the base, wherein the plurality of second support pins have upper surfaces at a level lower than the first level, and
wherein each of the plurality of first lift guard rings has an upper surface at the first level.