US 11,742,223 B2
Substrate processing apparatus
Yuji Kimura, Koshi (JP); and Yoshihiro Kai, Koshi (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Jan. 8, 2020, as Appl. No. 16/737,027.
Claims priority of application No. 2019-002793 (JP), filed on Jan. 10, 2019.
Prior Publication US 2020/0227290 A1, Jul. 16, 2020
Int. Cl. H01L 21/67 (2006.01); H01L 21/687 (2006.01); H01L 21/677 (2006.01)
CPC H01L 21/67086 (2013.01) [H01L 21/67057 (2013.01); H01L 21/67742 (2013.01); H01L 21/68771 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A substrate processing apparatus, comprising:
a processing tub in which a processing is performed on multiple substrates; and
a fluid supply disposed under the multiple substrates within the processing tub and configured to discharge a fluid within the processing tub,
wherein the fluid supply includes multiple discharge paths including a first discharge path having a first plurality of discharge openings and a second discharge path having a second plurality of discharge openings,
the first plurality of discharge openings provided in the first discharge path are arranged at a front side of the processing tub, and
the second plurality of discharge openings provided in the second discharge path are arranged at a back side of the processing tub,
wherein the fluid supply includes additional discharge paths configured to discharge the fluid and disposed in parallel to the multiple discharge paths in a direction orthogonal to the arrangement direction of the multiple substrates, and
inner diameters of the multiple discharge paths are smaller than those of the additional discharge paths,
wherein both of the multiple discharge paths and the additional discharge paths are connected to a same fluid source configured to supply the fluid.