CPC H01L 21/67034 (2013.01) [B08B 7/0042 (2013.01); B23K 26/352 (2015.10); G02B 27/0955 (2013.01); H01J 37/3244 (2013.01); H01J 37/32568 (2013.01); H01L 21/02098 (2013.01); H01J 2237/335 (2013.01); H01L 29/66545 (2013.01); H01L 29/66795 (2013.01); H10B 41/27 (2023.02); H10B 43/27 (2023.02)] | 7 Claims |
1. A dry cleaning method, comprising:
loading a substrate into a chamber;
supplying a dry cleaning gas into the chamber through a shower head;
generating plasma from the dry cleaning gas;
forming a cleaning process by-product by reacting the plasma with an etch residue on the substrate; and
irradiating a laser light on a surface of the substrate to heat the substrate, thereby transitioning the cleaning process by-product to a gaseous cleaning process by-product.
|