CPC H01L 21/0337 (2013.01) [H01L 21/0273 (2013.01); H01L 21/0332 (2013.01); H01L 21/31058 (2013.01); H01L 21/31116 (2013.01); H01L 21/31144 (2013.01); H01L 21/32135 (2013.01); H01L 21/32139 (2013.01)] | 20 Claims |
1. A device, comprising:
a substrate;
a multi-layer structure disposed on the substrate, the multi-layer structure comprising a first layer, a second layer over the first layer, and a third layer over the second layer;
a fourth layer, wherein a first portion of the fourth layer extends over the third layer of the multi-layer structure and a second portion of the fourth layer extends over the substrate away from the multi-layer structure, the first portion of the fourth layer is discontinuous with the second portion of the fourth layer, a portion of the second layer of the multi-layer structure is between the first portion of the fourth layer and the second portion of the fourth layer, and the second layer of the multi-layer structure being disposed at least partially at a same level as the second portion of the fourth layer; and
a fifth layer, wherein a first portion of the fifth layer contacts the first portion of the fourth layer, a second portion of the fifth layer contacts the second portion of the fourth layer, and the first portion of the fifth layer is continuous with the second portion of the fifth layer.
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