US 11,742,167 B2
Relay
Daishi Kitajima, Tokyo (JP); Kazuaki Miyanaga, Tokyo (JP); and Mitsuyoshi Mizuhashi, Tokyo (JP)
Assigned to FUJITSU COMPONENT LIMITED, Tokyo (JP)
Filed by Fujitsu Component Limited, Tokyo (JP)
Filed on Jun. 29, 2021, as Appl. No. 17/305,028.
Claims priority of application No. 2020-113338 (JP), filed on Jun. 30, 2020.
Prior Publication US 2021/0407754 A1, Dec. 30, 2021
Int. Cl. H01H 3/00 (2006.01); H01H 50/56 (2006.01); H01H 50/02 (2006.01)
CPC H01H 50/56 (2013.01) [H01H 50/02 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A relay, comprising:
a base;
an electromagnet mounted on the base; and
a spring inserted into the base, the spring including a contact which opens and closes with another contact in accordance with operation of the electromagnet, a terminal, and a raised part formed by folding a portion of the spring,
wherein the raised part elastically deforms due to its resilience when the raised part receives an external force, and
the base has a lock part which locks an end of the raised part positioned opposite to an insertion direction in which the spring is inserted into the base, so as to limit a movement of the spring in the insertion direction.