US 11,742,136 B2
Coil component
Young Sun Kim, Suwon-si (KR); Sung Hee Kim, Suwon-si (KR); and In Suk Kim, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Jul. 2, 2020, as Appl. No. 16/919,613.
Claims priority of application No. 10-2019-0127514 (KR), filed on Oct. 15, 2019.
Prior Publication US 2021/0110968 A1, Apr. 15, 2021
Int. Cl. H01F 27/36 (2006.01); H01F 27/24 (2006.01); H01F 27/28 (2006.01); H01F 27/32 (2006.01); H01F 41/04 (2006.01); H01F 41/12 (2006.01)
CPC H01F 27/36 (2013.01) [H01F 27/24 (2013.01); H01F 27/2804 (2013.01); H01F 27/324 (2013.01); H01F 41/041 (2013.01); H01F 41/12 (2013.01); H01F 2027/2809 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A coil component, comprising:
a support substrate including a through-hole disposed therein;
a body including the support substrate embedded therein, and having a core disposed in the through-hole of the support substrate;
a coil portion disposed on the support substrate, embedded in the body, and having a plurality of turns with reference to the core as an axis on the support substrate; and
a shielding pattern disposed between an internal wall of the support substrate, by which the through-hole is defined, and the core,
wherein the shielding pattern extends inward of an innermost portion of the coil portion relative to the axis.