US 11,740,953 B2
Solder joint damage-prevention mode for a computing device
Luke Manuel Brantingham, Chicago, IL (US); Kavinaath Murugan, Chicago, IL (US); Yun Sun Lee, Buffalo Grove, IL (US); and Aaditya Kandibanda, Aurora, IL (US)
Assigned to Google LLC, Mountain View, CA (US)
Filed by Google LLC, Mountain View, CA (US)
Filed on May 10, 2021, as Appl. No. 17/316,376.
Claims priority of provisional application 63/140,468, filed on Jan. 22, 2021.
Prior Publication US 2022/0237059 A1, Jul. 28, 2022
Int. Cl. G06F 11/00 (2006.01); G06F 1/20 (2006.01); G06F 1/3206 (2019.01); G06F 9/48 (2006.01); G01R 31/28 (2006.01); G01R 31/71 (2020.01)
CPC G06F 11/008 (2013.01) [G01R 31/2817 (2013.01); G01R 31/71 (2020.01)] 13 Claims
OG exemplary drawing
 
1. A method comprising:
detecting by a computing device, a first condition of the computing device, the first condition being a condition of the computing device or following which damage to solder joints of the computing device has an increased likelihood;
activating, by the computing device in response to detecting the first condition, a thermal-conditioning system to effectuate a change in a temperature of the solder joints, the change in temperature improving a mechanical robustness of the solder joints, the activating of the thermal-conditioning system including routing electrical current to one or more load resistors of the computing device;
detecting, by the computing device, a second condition of the computing device, the second condition being another condition in or following which the damage to solder joints of the computing device does not have the increased likelihood; and
deactivating, by the computing device, the thermal-conditioning system to effectuate another change in the temperature of the solder joints.