US 11,740,560 B2
Method for determining an inspection strategy for a group of substrates in a semiconductor manufacturing process
Eleftherios Koulierakis, Eindhoven (NL); Carlo Lancia, Eindhoven (NL); Juan Manuel Gonzalez Huesca, Eindhoven (NL); Alexander Ypma, Veldhoven (NL); Dimitra Gkorou, Eindhoven (NL); and Reza Sahraeian, Eindhoven (NL)
Assigned to ASML NETHERLANDS B.V., Veldhoven (NL)
Appl. No. 17/910,454
Filed by ASML NETHERLANDS B.V., Veldhoven (NL)
PCT Filed Mar. 1, 2021, PCT No. PCT/EP2021/054988
§ 371(c)(1), (2) Date Sep. 9, 2022,
PCT Pub. No. WO2021/197730, PCT Pub. Date Oct. 7, 2021.
Claims priority of application No. 20167648 (EP), filed on Apr. 2, 2020; application No. 20174335 (EP), filed on May 13, 2020; and application No. 20198754 (EP), filed on Sep. 28, 2020.
Prior Publication US 2023/0058166 A1, Feb. 23, 2023
Int. Cl. G03F 7/20 (2006.01); G03F 7/00 (2006.01)
CPC G03F 7/70525 (2013.01) 20 Claims
OG exemplary drawing
 
1. A method for determining an inspection strategy for at least one substrate, the method comprising:
quantifying, using a prediction model and based on one or both of pre-processing data associated with the at least one substrate and/or any available post-processing data associated with the at least one substrate, a compliance metric value for a compliance metric relating to a prediction of compliance with a quality requirement; and
deciding on an inspection strategy for the at least one substrate, based on the compliance metric value, an expected cost associated with the inspection strategy and at least one objective value describing an expected value of the inspection strategy in terms of at least one objective relating to the prediction model.