US 11,740,520 B2
Display panel and method of manufacturing the same
Jin-Soo Jung, Hwaseong-si (KR); Young Gu Kim, Hwaseong-si (KR); Byoung-Hun Sung, Hwaseong-si (KR); and Baekkyun Jeon, Yongin-si (KR)
Assigned to SAMSUNG DISPLAY CO., LTD., Yongin (KR)
Filed by SAMSUNG DISPLAY CO., LTD., Yongin-si (KR)
Filed on Jan. 21, 2022, as Appl. No. 17/580,912.
Application 15/078,636 is a division of application No. 13/830,766, filed on Mar. 14, 2013, granted, now 9,329,447, issued on May 3, 2016.
Application 17/580,912 is a continuation of application No. 16/790,402, filed on Feb. 13, 2020, granted, now 11,262,630.
Application 16/790,402 is a continuation of application No. 15/828,645, filed on Dec. 1, 2017, granted, now 10,578,939, issued on Mar. 3, 2020.
Application 15/828,645 is a continuation of application No. 15/078,636, filed on Mar. 23, 2016, granted, now 9,835,918, issued on Dec. 5, 2017.
Claims priority of application No. 10-2012-0066249 (KR), filed on Jun. 20, 2012.
Prior Publication US 2022/0146897 A1, May 12, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. G02F 1/1345 (2006.01); G02F 1/1333 (2006.01); G02F 1/1362 (2006.01); G02F 1/1368 (2006.01); H01L 33/08 (2010.01); F21V 8/00 (2006.01); G02F 1/1339 (2006.01)
CPC G02F 1/136286 (2013.01) [G02B 6/0083 (2013.01); G02F 1/1339 (2013.01); G02F 1/1368 (2013.01); G02F 1/13452 (2013.01); G02F 1/133345 (2013.01); G02F 1/136227 (2013.01); H01L 33/08 (2013.01); G02F 1/13458 (2013.01); H01L 2924/0002 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A display panel comprising:
a first substrate including a base substrate having a lower surface and an upper surface, a switching element disposed on the upper surface, a signal input pad, a signal line disposed on the upper surface and connecting the signal input pad to the switching element, and a protective layer disposed on the upper surface and overlapping the signal line;
a flexible printed circuit board disposed under the lower surface and connected to the signal input pad; and
a driver IC (Integrated Circuit) mounted on the flexible printed circuit board,
wherein data signals are transmitted from the driver IC to the switching element, and a portion of the signal input pad that is disposed between the lower surface and the flexible printed circuit board is exposed to an outside.