US 11,740,509 B2
Electronic device display with a backlight having light-emitting diodes and driver integrated circuits in an active area
David W. Lum, Cupertino, CA (US); Kyung Wook Kim, Saratoga, CA (US); Kwang Soon Park, San Ramon, CA (US); Mingxia Gu, Campbell, CA (US); and Jun Qi, San Jose, CA (US)
Assigned to Apple Inc., Cupertino, CA (US)
Filed by Apple Inc., Cupertino, CA (US)
Filed on Mar. 16, 2021, as Appl. No. 17/203,336.
Claims priority of provisional application 63/029,069, filed on May 22, 2020.
Claims priority of provisional application 63/029,048, filed on May 22, 2020.
Claims priority of provisional application 63/029,082, filed on May 22, 2020.
Prior Publication US 2021/0364854 A1, Nov. 25, 2021
Int. Cl. G02F 1/1335 (2006.01); G02F 1/13357 (2006.01); H05B 47/16 (2020.01); H05B 47/105 (2020.01); H01L 25/16 (2023.01); G09G 3/34 (2006.01)
CPC G02F 1/133612 (2021.01) [G02F 1/133601 (2021.01); G02F 1/133603 (2013.01); G02F 1/133605 (2013.01); G02F 1/133606 (2013.01); G02F 1/133628 (2021.01); G09G 3/3426 (2013.01); H01L 25/167 (2013.01); H05B 47/105 (2020.01); H05B 47/16 (2020.01); G09G 2320/0626 (2013.01)] 20 Claims
OG exemplary drawing
 
17. An electronic device comprising:
a plurality of pixels; and
a backlight configured to produce backlight illumination for the plurality of pixels, wherein the backlight comprises:
a glass thin-film circuitry layer including a conductive layer on a glass substrate;
a two-dimensional array of light-emitting diodes mounted on an upper surface of the glass thin-film circuitry layer;
driver integrated circuits mounted on the upper surface of the glass thin-film circuitry layer; and
a heat sink structure that is coupled to an exposed portion of the conductive layer.