US 11,740,415 B2
Structures and process flow for integrated photonic-electric IC package by using polymer waveguide
Yu-Hao Chen, Hinchu (TW); Hui-Yu Lee, Hsin-Chu (TW); Chung-Ming Weng, Hsin-Chu (TW); Jui-Feng Kuan, Zhubei (TW); and Chien-Te Wu, Hsin-Chu (TW)
Assigned to Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu (TW)
Filed on May 14, 2021, as Appl. No. 17/320,596.
Prior Publication US 2022/0365294 A1, Nov. 17, 2022
Int. Cl. G02B 6/42 (2006.01); G02B 6/122 (2006.01); H01L 25/16 (2023.01)
CPC G02B 6/4214 (2013.01) [G02B 6/1221 (2013.01); G02B 6/4201 (2013.01); G02B 6/4204 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A silicon photonic (SiPh) structure comprising:
an electrical integrated circuit (EIC);
a photonic integrated circuit (PIC) disposed on top of the EIC;
at least one polymer waveguide (PWG) disposed on top of the PIC and forming a polymer bridging layer, wherein the at least one PWG comprises a core layer comprising a first polymer and at least two cladding layers comprising a second polymer that surrounds the core layer;
an integration fan-out redistribution (InFO RDL) layer disposed on top of the at least one PWG;
at least one optical lens configured to direct a light signal through the InFO RDL layer; and
a SiPh grating coupler comprising first and second grating structures, respectively, wherein light from the at least one optical lens is received by the first grating structure, which changes a direction of the light so that the light is collected by the second grating structure so as to direct light between the PIC and the at least one PWG.