US 11,740,283 B2
Multistory electronic device testing apparatus
Chin-Yi Ouyang, Taoyuan (TW); Chien-Ming Chen, Taoyuan (TW); Wei-Cheng Kuo, Taoyuan (TW); Xin-Yi Wu, Taoyuan (TW); and Iching Tsai, Taoyuan (TW)
Assigned to CHROMA ATE INC., Taoyuan (TW)
Filed by CHROMA ATE INC., Taoyuan (TW)
Filed on Jun. 7, 2022, as Appl. No. 17/834,035.
Claims priority of application No. 110127099 (TW), filed on Jul. 23, 2021; and application No. 110127101 (TW), filed on Jul. 23, 2021.
Prior Publication US 2023/0022501 A1, Jan. 26, 2023
Int. Cl. G01R 31/28 (2006.01); G01R 1/04 (2006.01)
CPC G01R 31/2893 (2013.01) [G01R 1/0458 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A multistory electronic device testing apparatus, comprising:
a feeding and binning device;
a multi-axis transfer device;
at least one chip-testing device; and
a main controller, electrically connected to the feeding and binning device, the multi-axis transfer device and the at least one chip-testing device,
wherein the feeding and binning device includes an upper module and a lower module; the upper module is stacked on the lower module; the upper module and the lower module each include at least one feeding cassette, at least one discharge cassette, a shuttle and a chip transfer unit;
the at least one feeding cassette is provided to store at least one first tray; the at least one discharge cassette is provided to store at least one second tray; the at least one first tray is provided to receive at least one electronic device to be tested; the at least one second tray is provided to receive at least one tested electronic device,
wherein the main controller controls the shuttle to move between a first position and a second position; the shuttle includes at least one chip-accommodating slot; the main controller controls the chip transfer unit to take out the at least one electronic device to be tested from the at least one first tray and place the at least one electronic device to be tested in the at least one chip-accommodating slot of the shuttle located at the first position; and the main controller controls the chip transfer unit to take out the at least one tested electronic device from the at least one chip-accommodating slot of the shuttle located at the first position and place the at least one tested electronic device on the at least one second tray,
wherein the main controller controls the multi-axis transfer device to transfer the at least one electronic device to be tested between the at least one chip-accommodating slot of the shuttle located at the second position and the chip-testing device and transfer the at least one tested electronic device between the chip-testing device and the at least one chip-accommodating slot of the shuttle located at the second position.