US 11,740,137 B2
Multi-sensing PTAT for multiple-location temperature sensing
Scott David Kee, Aliso Viejo, CA (US)
Assigned to AyDeeKay LLC, Aliso Viejo, CA (US)
Filed by AyDeeKay LLC, Aliso Viejo, CA (US)
Filed on Sep. 29, 2020, as Appl. No. 17/37,311.
Prior Publication US 2022/0099501 A1, Mar. 31, 2022
Int. Cl. G01K 7/01 (2006.01); G01K 13/00 (2021.01); G05D 23/19 (2006.01); G05D 23/20 (2006.01)
CPC G01K 7/01 (2013.01) [G01K 13/00 (2013.01); G05D 23/193 (2013.01); G05D 23/1927 (2013.01); G05D 23/1932 (2013.01); G05D 23/2034 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An integrated circuit, comprising:
memory;
a controller coupled to the memory;
temperature sensors distributed at measurement locations in a semiconductor die, wherein a given temperature sensor comprises instances of building blocks that are included in all the temperature sensors; and
routing between the controller and the instances of the building blocks over an addressable bus, wherein signal lines for analog signals in the addressable bus are reused when communicating between the controller and different temperature sensors, wherein a number of the temperature sensors in the integrated circuit is limited by a number of bits used for addressing the temperature sensors.