US 11,740,110 B2
Sensor-device attachment structure
Tomohiro Kawamura, Chita-gun (JP)
Assigned to DENSO WAVE INCORPORATED, Aichi-Pref. (JP)
Filed by DENSO WAVE INCORPORATED, Chita-gun (JP)
Filed on Aug. 3, 2022, as Appl. No. 17/880,260.
Claims priority of application No. 2021-147920 (JP), filed on Sep. 10, 2021.
Prior Publication US 2023/0080689 A1, Mar. 16, 2023
Int. Cl. G01D 11/30 (2006.01)
CPC G01D 11/30 (2013.01) 7 Claims
OG exemplary drawing
 
1. A sensor-device attachment structure comprising:
a thin portion that is thinner than other parts of a member;
a flexible board;
at least one sensor device installed to the flexible board;
a spacer
that is formed into a shape of a film having a uniform thickness,
that is sandwiched between the thin portion and the flexible board, and
that includes a through portion which is formed through the spacer in a thickness direction of the spacer at a position corresponding to the at least one sensor device; and
an adhesive that
is charged in the through portion, and
bonds the thin portion and the flexible board to each other.