US 11,739,284 B2
Composite material
Satoshi Kubota, Chiba (JP); Gen Masuda, Chiba (JP); Takaya Sato, Tsuruoka (JP); and Hiroyuki Arafune, Tsuruoka (JP)
Assigned to NISSHINBO HOLDINGS INC., Tokyo (JP); and NATIONAL INSTITUTE OF TECHNOLOGY, Tokyo (JP)
Appl. No. 17/764,269
Filed by NISSHINBO HOLDINGS INC., Tokyo (JP); and NATIONAL INSTITUTE OF TECHNOLOGY, Hachioji (JP)
PCT Filed Sep. 23, 2020, PCT No. PCT/JP2020/035801
§ 371(c)(1), (2) Date Mar. 28, 2022,
PCT Pub. No. WO2021/065621, PCT Pub. Date Apr. 8, 2021.
Claims priority of application No. 2019-178545 (JP), filed on Sep. 30, 2019.
Prior Publication US 2022/0389347 A1, Dec. 8, 2022
Int. Cl. C10M 169/04 (2006.01); C10M 107/50 (2006.01); C10M 125/18 (2006.01); C10M 129/08 (2006.01); C10M 133/06 (2006.01); C10M 133/08 (2006.01); C10M 133/20 (2006.01); C10M 133/46 (2006.01); C10M 137/12 (2006.01); C10M 141/10 (2006.01); C10N 50/00 (2006.01)
CPC C10M 169/04 (2013.01) [C10M 107/50 (2013.01); C10M 125/18 (2013.01); C10M 129/08 (2013.01); C10M 133/06 (2013.01); C10M 133/08 (2013.01); C10M 133/20 (2013.01); C10M 133/46 (2013.01); C10M 137/12 (2013.01); C10M 141/10 (2013.01); C10M 2201/081 (2013.01); C10M 2207/022 (2013.01); C10M 2215/26 (2013.01); C10M 2215/28 (2013.01); C10M 2215/30 (2013.01); C10M 2223/06 (2013.01); C10M 2229/0515 (2013.01); C10M 2229/0535 (2013.01); C10N 2050/023 (2020.05)] 15 Claims
OG exemplary drawing
 
1. A composite material comprising a plurality of polymer chains fixed to a substrate and swelled with a mixture which contains a salt and a hydrogen bond-donating compound and has a melting point maintained at 100° C. or less, wherein the mixture has a melting point lower than that of the salt as a constituent of the mixture and that of the hydrogen bond-donating compound as a constituent of the mixture.