	US 11,739,238 B2
	Electrically conductive adhesive and electrically conductive material
Teppei Kunimune, Tokushima (JP); and Masafumi Kuramoto, Tokushima (JP)
Assigned to Nichia Corporation, Anan (JP)
Filed by Nichia Corporation, Anan (JP)
Filed on Sep. 29, 2021, as Appl. No. 17/488,687.
Application 17/488,687 is a division of application No. 15/711,284, filed on Sep. 21, 2017, granted, now 11,162,004.
Claims priority of application No. 2016-186115 (JP), filed on Sep. 23, 2016.
Prior Publication US 2022/0017793 A1, Jan. 20, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. C09J 9/02 (2006.01); C08K 3/08 (2006.01); C09J 171/02 (2006.01)

CPC C09J 9/02 (2013.01) [C08K 3/08 (2013.01); C09J 171/02 (2013.01); C08K 2003/0806 (2013.01); C09J 2471/00 (2013.01); C09J 2483/00 (2013.01)]

20 Claims

1. A method of producing an electrically conductive material, comprising hardening, at a temperature in a range of 120° C. to 300° C., an electrically conductive adhesive comprising:

(A) a polyether polymer having:

a backbone comprising a repeating unit of the formula:

—R¹—O—

wherein R¹is a hydrocarbon group having 1 to 10 carbon atoms, and

an end group which is a hydrolyzable silyl group, and

(B) silver particles.