CPC B81B 7/0019 (2013.01) [B81B 7/0087 (2013.01); G01K 1/20 (2013.01); G01L 9/0072 (2013.01); G01L 19/04 (2013.01); B81B 2201/0242 (2013.01)] | 18 Claims |
1. A microelectromechanical system (MEMS) device, comprising:
a first layer comprising a first plane;
a second layer comprising a second plane, wherein the second layer is located below the first layer;
at least one anchor, wherein the at least one anchor couples the first layer to the second layer;
a plurality of temperature sensors located within the second plane; and
one or more switching elements, wherein the one or more switching elements selectively monitor the plurality of temperature sensors, wherein the one or more switching elements selectively combine temperature sensor outputs from a first subset of the plurality of temperature sensors to measure a first temperature characteristic corresponding to the first subset, and wherein the one or more switching elements switch a second subset of the plurality of temperature sensors to reject a second temperature characteristic corresponding to the second subset, wherein the first temperature characteristic is a vertical thermal gradient perpendicular to the second layer and the second temperature characteristic is a lateral thermal gradient parallel to the second layer.
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