US 11,738,415 B2
Flux, solder paste and method for producing soldered product
Takafumi Ohtake, Tokyo (JP); Hiroaki Kawamata, Tokyo (JP); Shinji Kikuchi, Tokyo (JP); Keisuke Shinozaki, Tokyo (JP); Yuki Fujino, Tokyo (JP); and Kazuya Kitazawa, Tokyo (JP)
Assigned to SENJU METAL INDUSTRY CO., LTD., Tokyo (JP)
Appl. No. 17/793,565
Filed by SENJU METAL INDUSTRY CO., LTD., Tokyo (JP)
PCT Filed Mar. 22, 2021, PCT No. PCT/JP2021/011763
§ 371(c)(1), (2) Date Jul. 18, 2022,
PCT Pub. No. WO2021/200345, PCT Pub. Date Oct. 7, 2021.
Claims priority of application No. 2020-060307 (JP), filed on Mar. 30, 2020.
Prior Publication US 2023/0107101 A1, Apr. 6, 2023
Int. Cl. B23K 35/36 (2006.01); B23K 35/362 (2006.01); B23K 35/02 (2006.01); B23K 101/42 (2006.01)
CPC B23K 35/362 (2013.01) [B23K 35/3612 (2013.01); B23K 35/025 (2013.01); B23K 2101/42 (2018.08)] 12 Claims
 
11. A solder paste comprising:
a flux for soldering, comprising:
10 to 40 wt % of coumarin;
5 to 30 wt % of a monoamide-based thixotropic agent; and
40 to 80 wt % of a solvent; and
a solder powder.