CPC B23K 35/362 (2013.01) [B23K 35/3612 (2013.01); B23K 35/025 (2013.01); B23K 2101/42 (2018.08)] | 12 Claims |
11. A solder paste comprising:
a flux for soldering, comprising:
10 to 40 wt % of coumarin;
5 to 30 wt % of a monoamide-based thixotropic agent; and
40 to 80 wt % of a solvent; and
a solder powder.
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