US 12,400,904 B2
Thermal processing susceptor
Anhthu Ngo, San Jose, CA (US); Zuoming Zhu, Sunnyvale, CA (US); Balasubramanian Ramachandran, Cupertino, CA (US); Paul Brillhart, Pleasanton, CA (US); Edric Tong, Sunnyvale, CA (US); Anzhong Chang, San Jose, CA (US); Kin Pong Lo, Fremont, CA (US); Kartik Shah, Saratoga, CA (US); Schubert S. Chu, San Francisco, CA (US); Zhepeng Cong, San Jose, CA (US); James Francis Mack, Woodside, CA (US); Nyi O. Myo, San Jose, CA (US); Kevin Joseph Bautista, San Jose, CA (US); Xuebin Li, Sunnyvale, CA (US); Yi-Chiau Huang, Fremont, CA (US); and Zhiyuan Ye, San Jose, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Dec. 14, 2023, as Appl. No. 18/539,507.
Application 18/539,507 is a division of application No. 17/183,146, filed on Feb. 23, 2021, granted, now 11,848,226.
Application 16/109,945 is a division of application No. 14/698,793, filed on Apr. 28, 2015, granted, now 10,062,598, issued on Aug. 28, 2018.
Application 17/183,146 is a continuation of application No. 16/109,945, filed on Aug. 23, 2018, granted, now 10,930,543, issued on Feb. 23, 2021.
Claims priority of provisional application 62/001,562, filed on May 21, 2014.
Prior Publication US 2024/0112945 A1, Apr. 4, 2024
Int. Cl. H01L 21/687 (2006.01); B05C 13/00 (2006.01); B05C 13/02 (2006.01); C30B 25/12 (2006.01); H01L 21/67 (2006.01); H01L 21/673 (2006.01); H01L 21/683 (2006.01); C23C 16/458 (2006.01)
CPC H01L 21/68735 (2013.01) [B05C 13/00 (2013.01); B05C 13/02 (2013.01); C30B 25/12 (2013.01); H01L 21/67326 (2013.01); H01L 21/6875 (2013.01); H01L 21/68785 (2013.01); C23C 16/4583 (2013.01); C23C 16/4585 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of processing a substrate comprising:
positioning an outer portion of a substrate on:
a plurality of wedges extending radially inward from an inner edge of an outer rim above an inner dish of a susceptor, wherein each wedge is separated from two other wedges by a gap and the outer rim is elevated relative to the plurality of wedges; and
an insulating separator disposed between each of the wedges, each insulating separator contacting two wedges and the inner edge of the outer rim; and
supporting an inner portion of the substrate with one or more bumps of a plurality of bumps, each bump located closer than each wedge to a center of the inner dish;
performing a process on the substrate inside a process chamber.