CPC H10K 71/15 (2023.02) [H10K 30/35 (2023.02); H10K 30/451 (2023.02); H10K 71/135 (2023.02)] | 16 Claims |
1. A method for depositing one or more layers of an optoelectronic device, the method comprising:
depositing one or more formulation by slot-die deposition, wherein said one or more formulation comprises:
one or more selected from the group consisting of: nanoparticles of a metal oxide material, metal-organic precursors of said metal oxide material, and carbon; and,
a carrier composition comprising a solvent mixture comprising one or more low boiling point solvent and one or more high boiling point solvent, wherein said one or more low boiling point solvent has a boiling point of <200° C. and said one or more high boiling point solvent has a boiling point of ≥200° ° C.
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