US 12,069,881 B2
Bonding member, display module, and method of fabricating display device
Yong Hwan Shin, Asan-si (KR); and Sung Chul Kim, Busan (KR)
Assigned to SAMSUNG DISPLAY CO., LTD., Gyeonggi-Do (KR)
Filed by Samsung Display Co., Ltd., Yongin-si (KR)
Filed on Apr. 1, 2020, as Appl. No. 16/837,951.
Claims priority of application No. 10-2019-0052999 (KR), filed on May 7, 2019.
Prior Publication US 2020/0358027 A1, Nov. 12, 2020
Int. Cl. H10K 50/842 (2023.01); B32B 3/26 (2006.01); B32B 7/12 (2006.01); H10K 50/86 (2023.01); H10K 71/00 (2023.01)
CPC H10K 50/8426 (2023.02) [B32B 3/266 (2013.01); B32B 7/12 (2013.01); H10K 50/8428 (2023.02); H10K 50/86 (2023.02); H10K 71/00 (2023.02); B32B 2457/20 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A display module for a display device comprising:
a display panel;
a first inter-module bonding layer disposed on an upper surface of the display panel;
a first protective film having first surface and second opposed surfaces, the first protective film being disposed on an upper surface of the first inter-module bonding layer and having a light absorbing pattern disposed on the first surface or the second surface of the first protective film; and
a through hole extending through the display panel, the first inter-module bonding layer and the first protective film,
wherein the light absorbing pattern at least partially surrounds the through hole, wherein the display panel comprises:
a display member including a substrate and a light emitting layer disposed on the substrate;
an optical film disposed on the display member; and
a second inter-module bonding layer to attach the display member and the optical film together,
wherein the first inter-module bonding layer has a first thickness and the second inter-module bonding layer has a second thickness smaller than the first thickness.