US 12,069,856 B2
Methods of forming electronic devices using materials removable at different temperatures
Chandra S. Tiwari, Boise, ID (US); and Kunal Shrotri, Boise, ID (US)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Oct. 17, 2022, as Appl. No. 18/047,214.
Application 18/047,214 is a continuation of application No. 16/887,178, filed on May 29, 2020, granted, now 11,476,268.
Prior Publication US 2023/0061820 A1, Mar. 2, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H10B 41/27 (2023.01); H10B 41/10 (2023.01); H10B 51/00 (2023.01)
CPC H10B 41/27 (2023.02) [H10B 51/00 (2023.02); H10B 41/10 (2023.02)] 20 Claims
OG exemplary drawing
 
1. A method of forming an electronic device comprising:
forming alternating first materials and second materials on a base material, the first materials and the second materials formulated to be removable at different temperatures;
forming a sacrificial material in a pillar opening extending through the alternating first materials and second materials;
removing the first materials to form first spaces adjacent to the second materials, the first materials formulated to be in a liquid phase or in a gas phase at a first removal temperature;
forming stack materials in the first spaces;
removing the second materials to form second spaces adjacent to the stack materials, the second materials formulated to be in a liquid phase or in a gas phase at a second removal temperature;
forming other stack materials in the second spaces;
removing the sacrificial material from the pillar opening; and
forming cell materials in the pillar opening.