US 12,069,845 B2
Conformal electromagnetic interference shielding film
Jaejin Lee, Redmond, WA (US); Bo Dan, Redmond, WA (US); and Han Li, Sammamish, WA (US)
Assigned to Microsoft Technology Licensing, LLC, Redmond, WA (US)
Filed by Microsoft Technology Licensing, LLC, Redmond, WA (US)
Filed on Apr. 26, 2022, as Appl. No. 17/660,789.
Prior Publication US 2023/0345687 A1, Oct. 26, 2023
Int. Cl. H05K 9/00 (2006.01); H05K 1/02 (2006.01); H05K 3/28 (2006.01)
CPC H05K 9/0088 (2013.01) [H05K 1/0216 (2013.01); H05K 3/284 (2013.01); H05K 2203/1322 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A conformal electromagnetic interference (EMI) shielding film, comprising: a thermal-forming film layer configured to conformally coat over one or more electronic components mounted on a substrate with application of heat; and an electrically conductive film layer formed on an opposite side of the thermal-forming film layer from the substrate and having a plurality of voids that are configured to deform during the application of heat and allow the electrically conductive film layer to conform together with the thermal-forming film layer, wherein in a first area of the electrically conductive film layer, the plurality of voids are formed at a first density, and in a second area of the electrically conductive film layer, the plurality of voids are formed at a second density different density than the first density.