CPC H05K 7/209 (2013.01) [H05K 7/2049 (2013.01); H05K 7/20445 (2013.01); H05K 7/20454 (2013.01)] | 17 Claims |
1. A cooling device for a power electronics module for cooling a power electronic assembly of the power electronics module, the cooling device comprising:
a heatsink configured to dissipate waste heat from at least one power electronic component arranged on a circuit board of the power electronic assembly; and
at least one heat-conducting element configured to provide a heat-conducting path between the at least one power electronic component and the heatsink, wherein the at least one heat-conducting element comprises:
a cooling adapter that is separate from the heatsink and has a heat-conducting core, which heat-conducting core is configured to be arranged between the heatsink and the power electronic assembly and to bridge a distance between the at least one power electronic component and the heatsink;
a sheath at least partly surrounding a lateral surface of the heat-conducting core, the sheath comprising, at least in some sections, a collar projecting laterally from the heat-conducting core; and
spring elements formed on the collar that are configured to force the cooling adapter away from a carrier plate and to press the heat-conducting core onto the power electronic assembly.
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