US 12,069,841 B2
Radiator and electrical device
Jie Zhou, Hefei (CN); Gaozhou Tao, Hefei (CN); and Liwen Hu, Hefei (CN)
Assigned to Sungrow Power Supply Co., Ltd., Hefei (CN)
Appl. No. 17/440,696
Filed by Sungrow Power Supply Co., Ltd., Hefei (CN)
PCT Filed Nov. 30, 2020, PCT No. PCT/CN2020/132685
§ 371(c)(1), (2) Date Sep. 17, 2021,
PCT Pub. No. WO2021/109964, PCT Pub. Date Jun. 10, 2021.
Claims priority of application No. 201922177965.9 (CN), filed on Dec. 6, 2019.
Prior Publication US 2022/0192048 A1, Jun. 16, 2022
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/209 (2013.01) [H05K 7/2039 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A radiator, comprising a heat dissipation substrate and a heat dissipation component, wherein a mounting position for mounting the heat dissipation component is provided on the heat dissipation substrate, a stress relieve groove is formed at the mounting position, and the heat dissipation component is welded to the mounting position,
wherein the mounting position is a welding groove recessed below a surface of the heat dissipation substrate.