US 12,069,810 B2
Solder paste stencil with aperture wall coating
Fakhrozi Bin Che Ani, Parit Buntar (MY); Mohamad Riduwan Bin Ramli, Began Serai (MY); Mohamad Solehin Bin Mohamed Sunar, Nibong Tebal (MY); and Ibrahym Bin Ahmad, Bukit Mertajam (MY)
Assigned to Sandisk Technologies, Inc., Milpitas, CA (US)
Filed by Western Digital Technologies, Inc., San Jose, CA (US)
Filed on Jun. 21, 2021, as Appl. No. 17/353,192.
Claims priority of provisional application 63/114,761, filed on Nov. 17, 2020.
Prior Publication US 2022/0159842 A1, May 19, 2022
Int. Cl. H05K 3/12 (2006.01); H05K 3/24 (2006.01); H05K 3/34 (2006.01); H05K 1/11 (2006.01); H05K 3/28 (2006.01)
CPC H05K 3/1225 (2013.01) [H05K 3/1233 (2013.01); H05K 3/24 (2013.01); H05K 1/115 (2013.01); H05K 3/282 (2013.01); H05K 3/3485 (2020.08); H05K 2203/0726 (2013.01); H05K 2203/1366 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A surface mount technology (SMT) solder paste stencil, comprising:
a substrate defining a plurality of solder apertures, each aperture wall of each of the plurality of solder apertures is coated with a coating material that enhances a smoothness of the each aperture wall in a SMT process and reduces wetting of a solder paste relative to the each aperture wall,
wherein the coating material has a first water contact angle greater than a second water contact angle of the substrate without the coating material,
wherein the coating material is a silicone material,
wherein the first water contact angle is greater than thirty-nine degrees and less than one hundred and ten degrees, and
wherein second water contact angle is thirty-nine degrees or less.