US 12,069,808 B2
Electronic component on flexible substrate
Margaretha Maria De Kok, Eindhoven (NL); Gerardus Titus Van Heck, Eindhoven (NL); and Jeroen Franciscus Marinus Schram, Waalre (NL)
Assigned to Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO, 's-Gravenhage (NL)
Appl. No. 17/634,019
Filed by Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO, 's-Gravenhage (NL)
PCT Filed Aug. 18, 2020, PCT No. PCT/NL2020/050516
§ 371(c)(1), (2) Date Feb. 9, 2022,
PCT Pub. No. WO2021/034193, PCT Pub. Date Feb. 25, 2021.
Claims priority of application No. 19192351 (EP), filed on Aug. 19, 2019.
Prior Publication US 2022/0330433 A1, Oct. 13, 2022
Int. Cl. H05K 1/18 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 3/32 (2006.01)
CPC H05K 1/189 (2013.01) [H05K 1/0283 (2013.01); H05K 1/038 (2013.01); H05K 1/0393 (2013.01); H05K 3/321 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/0323 (2013.01); H05K 2203/0278 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A method for connecting an electronic component to a conductive track on a flexible substrate, the method comprising:
providing a connection layer on the conductive track, wherein the connection layer is formed of a sheet comprising a thermoplastic material, wherein the connection layer has at least one cutout, and wherein the at least one cutout is aligned to at least partially overlap the conductive track;
filling, at least partially, the at least one cutout with a thermosetting material in liquid state, wherein the thermosetting material is electrically conductive at least when solidified;
positioning, after the filling, the electronic component on the connection layer, wherein a contact point of the electronic component is aligned to contact the thermosetting material in the cutout; and
applying heat to raise a temperature of the connection layer to above a softening temperature of the thermoplastic material of the connection layer, and applying pressure to form a mechanical connection between the electronic component and the flexible substrate and/or the conductive tracks on the flexible substrate by plastic deformation of the connection layer raised above the softening temperature;
wherein the applying heat affects raising a temperature of the thermosetting material above a thermosetting temperature for solidifying the thermosetting material that forms an electrical connection between the contact point of the electronic component and the conductive track on the flexible substrate.