CPC H05K 1/189 (2013.01) [H05K 1/0283 (2013.01); H05K 1/038 (2013.01); H05K 1/0393 (2013.01); H05K 3/321 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/0323 (2013.01); H05K 2203/0278 (2013.01)] | 16 Claims |
1. A method for connecting an electronic component to a conductive track on a flexible substrate, the method comprising:
providing a connection layer on the conductive track, wherein the connection layer is formed of a sheet comprising a thermoplastic material, wherein the connection layer has at least one cutout, and wherein the at least one cutout is aligned to at least partially overlap the conductive track;
filling, at least partially, the at least one cutout with a thermosetting material in liquid state, wherein the thermosetting material is electrically conductive at least when solidified;
positioning, after the filling, the electronic component on the connection layer, wherein a contact point of the electronic component is aligned to contact the thermosetting material in the cutout; and
applying heat to raise a temperature of the connection layer to above a softening temperature of the thermoplastic material of the connection layer, and applying pressure to form a mechanical connection between the electronic component and the flexible substrate and/or the conductive tracks on the flexible substrate by plastic deformation of the connection layer raised above the softening temperature;
wherein the applying heat affects raising a temperature of the thermosetting material above a thermosetting temperature for solidifying the thermosetting material that forms an electrical connection between the contact point of the electronic component and the conductive track on the flexible substrate.
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