US 12,069,807 B2
Reinforcement structures for surface mount packaging components
Jason Graham, Prior Lake, MN (US)
Assigned to Simmonds Precision Products, Inc., Vergennes, VT (US)
Filed by Simmonds Precision Products, Inc., Vergennes, VT (US)
Filed on Mar. 27, 2022, as Appl. No. 17/705,351.
Prior Publication US 2023/0309232 A1, Sep. 28, 2023
Int. Cl. H05K 1/18 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01)
CPC H05K 1/181 (2013.01) [H01L 23/49816 (2013.01); H01L 23/562 (2013.01); H05K 2201/10734 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A system, comprising,
a reinforcement structure configured to seat in an air gap between one or more solder balls of a ball grid array of a surface mount packaging component, the reinforcement structure configured to reduce bending of a circuit board during acceleration of the circuit board, further comprising one or more support beams configured to seat in the air gap between the one or more solder balls to provide an airflow path through and under the ball grid array during reflow.