US 12,069,804 B2
Electronic device comprising printed circuit board assembly
Kyujin Kwak, Gyeonggi-do (KR); Jinwoo Park, Gyeonggi-do (KR); Yonglak Cho, Gyeonggi-do (KR); and Jiwoo Lee, Gyeonggi-do (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
Filed on Dec. 23, 2021, as Appl. No. 17/560,689.
Application 17/560,689 is a continuation of application No. PCT/KR2020/008505, filed on Jun. 30, 2020.
Claims priority of application No. 10-2019-0088178 (KR), filed on Jul. 22, 2019.
Prior Publication US 2022/0117086 A1, Apr. 14, 2022
Int. Cl. H05K 1/02 (2006.01); H05K 1/11 (2006.01)
CPC H05K 1/115 (2013.01) [H05K 1/0218 (2013.01); H05K 1/0243 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a printed circuit board assembly including a first circuit board, a second circuit board disposed over the first circuit board and smaller than the first circuit board, and an interposer board coupling the first circuit board with the second circuit board, wherein at least a portion of the interposer board is disposed along a portion of an edge of the second circuit board;
a first electrical or electronic component mounted on the first circuit board in a portion of the first circuit board on which the second circuit board is not disposed;
a first support member on which the printed circuit board assembly disposed; and
a second support member which covers the portion of the first circuit board forming a space between the portion of the first circuit board and the second support member and including a first portion connected to the first support member and a second portion which press a first portion of the portion of the edge of the second circuit board, and
wherein the second support member is spaced apart from the first electrical or electronic component.