US 12,069,796 B2
Storage device unit
Shigehito Morita, Hyogo (JP); Mitsuhiro Iizuka, Osaka (JP); Junichi Ito, Osaka (JP); Keiichi Omyo, Nara (JP); Toshiya Senoh, Nara (JP); Masato Yanai, Osaka (JP); and Naoto Nishiura, Kyoto (JP)
Assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka (JP)
Filed by Panasonic Intellectual Property Management Co., Ltd., Osaka (JP)
Filed on Dec. 28, 2021, as Appl. No. 17/563,159.
Application 17/563,159 is a continuation of application No. PCT/JP2020/025836, filed on Jul. 1, 2020.
Claims priority of application No. 2019-125413 (JP), filed on Jul. 4, 2019.
Prior Publication US 2022/0124907 A1, Apr. 21, 2022
Int. Cl. H05K 1/02 (2006.01); H01L 23/34 (2006.01); G11C 5/06 (2006.01); H05K 1/16 (2006.01)
CPC H05K 1/0212 (2013.01) [H01L 23/345 (2013.01); H05K 1/0224 (2013.01); H05K 1/0298 (2013.01); G11C 5/06 (2013.01); H01L 23/34 (2013.01); H05K 1/167 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10159 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A storage device unit comprising:
a substrate having a main surface and having a plurality of wiring layers stacked together; and
a storage device that has a plate shape having a first major surface and a second major surface parallel and opposite to the first major surface;
wherein the plurality of wiring layers includes a heat-generating layer having a heat-generating circuit,
the first major surface of the storage device faces the main surface of the substrate,
the plurality of wiring layers includes a ground layer having a ground pattern, the ground layer is provided between the heat-generating layer and the storage device,
the plurality of wiring layers includes a layer having a thermistor, the layer having the thermistor is located between the ground layer and the storage device,
the layer having the thermistor is a layer closest to the storage device among the plurality of wiring layers, and
the thermistor is provided in a first end region of the substrate, the first end region being opposite to a second end region of the substrate in a longitudinal direction of the substrate, the second end region of the substrate being where a connector is disposed on the main surface of the substrate.