CPC H05K 1/0203 (2013.01) [H05K 2201/066 (2013.01); H05K 2201/10734 (2013.01)] | 20 Claims |
1. An apparatus comprising:
a ball grid array device;
a heat sink thermally coupled to the ball grid array device; and
a pressure control assembly configured to dynamically control a pressure of the heat sink on the ball grid array device based on a temperature associated with the ball grid array device,
wherein the pressure control assembly includes a shape memory alloy washer configured to apply a first amount of the pressure when the shape memory alloy washer is in a first state, and a second amount of the pressure when the shape memory alloy washer is in a second state.
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