US 12,069,794 B2
Dynamic control of heat sink pressure
Rohit Dev Gupta, Brookefield Bangalore (IN); Arjun Jayaprakash Guzar, Puttenahalli Bengaluru (IN); and Tilak Gaitonde, Jakkur Bangalore (IN)
Assigned to CISCO TECHNOLOGY, INC., San Jose, CA (US)
Filed by Cisco Technology, Inc., San Jose, CA (US)
Filed on Jul. 6, 2022, as Appl. No. 17/858,819.
Prior Publication US 2024/0015880 A1, Jan. 11, 2024
Int. Cl. H05K 1/02 (2006.01)
CPC H05K 1/0203 (2013.01) [H05K 2201/066 (2013.01); H05K 2201/10734 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a ball grid array device;
a heat sink thermally coupled to the ball grid array device; and
a pressure control assembly configured to dynamically control a pressure of the heat sink on the ball grid array device based on a temperature associated with the ball grid array device,
wherein the pressure control assembly includes a shape memory alloy washer configured to apply a first amount of the pressure when the shape memory alloy washer is in a first state, and a second amount of the pressure when the shape memory alloy washer is in a second state.