US 12,069,424 B2
Vibration removal apparatus and method for dual-microphone earphones
Lei Zhang, Shenzhen (CN); Fengyun Liao, Shenzhen (CN); and Xin Qi, Shenzhen (CN)
Assigned to SHENZHEN SHOKZ CO., LTD., Shenzhen (CN)
Filed by SHENZHEN SHOKZ CO., LTD., Guangdong (CN)
Filed on May 16, 2022, as Appl. No. 17/663,665.
Application 17/663,665 is a continuation of application No. 17/079,438, filed on Oct. 24, 2020, granted, now 11,356,765.
Application 17/079,438 is a continuation of application No. PCT/CN2018/084588, filed on Apr. 26, 2018.
Prior Publication US 2022/0279268 A1, Sep. 1, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. G10K 11/178 (2006.01); H04R 1/10 (2006.01)
CPC H04R 1/1083 (2013.01) [G10K 11/178 (2013.01); G10K 2210/1081 (2013.01); G10K 2210/129 (2013.01); H04R 2410/05 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A microphone apparatus, comprising a microphone and a vibration sensor, wherein
the microphone is configured to receive a first signal including a voice signal and a first vibration signal;
the vibration sensor is configured to receive a second vibration signal, the first vibration signal and the second vibration signal originating from a vibration of vibration source;
a cavity volume of the vibration sensor is larger than a cavity volume of the microphone; and
the microphone and the vibration sensor are located at adjacent positions or at symmetrical positions with respect to the vibration source.