US 12,069,386 B2
Solid-state imaging device and electronic device
Ryoji Eki, Kanagawa (JP)
Assigned to SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
Filed on Apr. 26, 2023, as Appl. No. 18/307,511.
Application 18/307,511 is a continuation of application No. 17/661,857, filed on May 3, 2022, granted, now 11,665,442.
Application 17/661,857 is a continuation of application No. 17/250,438, granted, now 11,350,046, issued on May 31, 2022, previously published as PCT/JP2019/030092, filed on Jul. 31, 2019.
Claims priority of application No. 2018-144172 (JP), filed on Jul. 31, 2018; and application No. 2019-140824 (JP), filed on Jul. 31, 2019.
Prior Publication US 2023/0262348 A1, Aug. 17, 2023
Int. Cl. H04N 25/46 (2023.01); H04N 23/61 (2023.01); H04N 25/40 (2023.01); H04N 25/50 (2023.01)
CPC H04N 25/46 (2023.01) [H04N 23/61 (2023.01); H04N 25/41 (2023.01); H04N 25/50 (2023.01)] 8 Claims
OG exemplary drawing
 
1. A solid-state imaging device, comprising:
an imager configured to acquire image data;
a processing unit configured to execute a first process using a neural network calculation model, based on the acquired image data; and
a control unit configured to:
control a second process that executes readout of the image data from the imager; and
switch between a first process mode and a second process mode based on a predetermined condition, wherein
in the first process mode, the first process is started after the second process is completed, and
in the second process mode, the first process is started before the second process is completed.