US 12,069,361 B2
Camera module having circuit board with imrpoved flatness and electronic device
Kun Li, Jincheng (CN); Shin-Wen Chen, New Taipei (TW); Bo-Ying Zhu, New Taipei (TW); Yu-Shuai Li, Shenzhen (CN); Jian-Chao Song, Jincheng (CN); and Wu-Tong Wang, Jincheng (CN)
Assigned to Rayprus Technology (Foshan) Co., Ltd., Foshan (CN)
Filed by Rayprus Technology (Foshan) Co., Ltd., Foshan (CN)
Filed on Jan. 9, 2023, as Appl. No. 18/094,587.
Claims priority of application No. 202211104329.3 (CN), filed on Sep. 9, 2022.
Prior Publication US 2024/0089573 A1, Mar. 14, 2024
Int. Cl. H04N 23/57 (2023.01); H04N 23/51 (2023.01); H04N 23/55 (2023.01)
CPC H04N 23/55 (2023.01) [H04N 23/51 (2023.01); H04N 23/57 (2023.01)] 20 Claims
OG exemplary drawing
 
1. A camera module comprising:
a photosensitive assembly comprising:
a circuit board comprising a first surface, a second surface opposite to the first surface, and a first through hole extending through the first surface and the second surface;
a photosensitive chip disposed on the second surface, the photosensitive chip having a photosensitive area and a non-photosensitive area connected to the photosensitive area, the non-photosensitive area being electrically connected to one side of the second surface, and the photosensitive area being exposed from the first through hole;
a reinforcing plate disposed on the first surface; and
a thermal conductive layer disposed on the photosensitive chip, and the thermal conductive layer comprising a silica gel or a metal.