US 12,068,791 B2
Photonic chip coupler connector module
Thomas R. Marrapode, Naperville, IL (US); Zuon-Min Chuang, Taoyuan (TW); Sung-Ping Huang, Hsinchu (TW); and Wenzong Chen, Naperville, IL (US)
Assigned to Molex, LLC, Lisle, IL (US)
Filed by Molex, LLC, Lisle, IL (US)
Filed on Jul. 19, 2021, as Appl. No. 17/379,110.
Claims priority of provisional application 63/055,901, filed on Jul. 24, 2020.
Prior Publication US 2022/0029712 A1, Jan. 27, 2022
Int. Cl. G02B 6/42 (2006.01); G02B 6/38 (2006.01); H04B 10/80 (2013.01)
CPC H04B 10/801 (2013.01) [G02B 6/3882 (2013.01); G02B 6/3885 (2013.01); G02B 6/4202 (2013.01); G02B 6/4218 (2013.01); G02B 6/4238 (2013.01); G02B 6/4261 (2013.01)] 21 Claims
OG exemplary drawing
 
1. An optical interconnect module comprising:
a coupler for interfacing to a photonic integrated chip, the coupler comprising at least one guide pin; and
an optical ferrule configured for being removably attached to the coupler, the optical ferrule comprising at least one through hole for receiving the at least one guide pin from the coupler, wherein the coupler further comprises a waveguide structure and a lens plate to couple optical fiber signals of optical fibers, wherein the waveguide structure is configured to direct multiple rows of optical fiber signals on to a single row of optical fiber signals through optical waveguide coupling, and the lens plate extends downwardly from a bottom surface of the coupler and is configured to connect the optical fibers and the photonic integrated chip.