US 12,068,784 B2
Transceiver device
Hideaki Fukuzawa, Tokyo (JP); Tomohito Mizuno, Tokyo (JP); Tetsuya Shibata, Tokyo (JP); and Takashi Kikukawa, Tokyo (JP)
Assigned to TDK CORPORATION, Tokyo (JP)
Filed by TDK CORPORATION, Tokyo (JP)
Filed on Jun. 15, 2023, as Appl. No. 18/210,333.
Application 18/210,333 is a continuation of application No. 17/507,143, filed on Oct. 21, 2021, granted, now 11,722,222.
Claims priority of application No. 2020-178235 (JP), filed on Oct. 23, 2020; application No. 2021-103981 (JP), filed on Jun. 23, 2021; application No. 2021-127523 (JP), filed on Aug. 3, 2021; and application No. 2021-128190 (JP), filed on Aug. 4, 2021.
Prior Publication US 2023/0327773 A1, Oct. 12, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H04B 10/40 (2013.01); H04B 10/50 (2013.01); H04B 10/532 (2013.01)
CPC H04B 10/503 (2013.01) [H04B 10/40 (2013.01); H04B 10/532 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A transceiver device comprising:
a receiving device including a magnetic element having a first ferromagnetic layer, a second ferromagnetic layer, and a spacer layer sandwiched between the first ferromagnetic layer and the second ferromagnetic layer, wherein the receiving device is configured to receive an optical signal;
a transmission device including an optical modulation element, wherein the transmission device is configured to transmit an optical signal; and
a circuit chip including an integrated circuit and an insulating layer, wherein
the optical modulation element includes a substrate having insulating properties and a waveguide provided on the substrate,
the receiving device and the transmission device are arranged on a first surface of the circuit chip and are positioned at positions where the receiving device and the transmission device do not overlap each other when viewed from a z direction which is orthogonal to the first surface of the circuit chip,
the magnetic element and the integrated circuit are electrically connected by a first through wiring which passes through the insulating layer in the z direction, and
the optical modulation element and the integrated circuit are electrically connected by a second through wiring which passes through the substrate in the z direction.