CPC H04B 1/3838 (2013.01) [A45C 11/00 (2013.01); C08K 7/22 (2013.01); C08K 7/28 (2013.01); C08L 33/08 (2013.01); C08L 53/00 (2013.01); C08L 75/08 (2013.01); H01Q 1/005 (2013.01); H01Q 1/526 (2013.01); H04B 1/3888 (2013.01); A45C 2011/002 (2013.01); C08K 2201/00 (2013.01); C08K 2201/003 (2013.01); C08K 2201/005 (2013.01)] | 10 Claims |
1. A method of reducing signal attenuation by an impact protective cover for a 5G wireless communications device, said method comprising providing a protective cover, the cover being formed from a thermoplastic elastomer resin composition having hollow microspheres dispersed therein, wherein the hollow microspheres have a wall thickness of from 2 to 20% of the diameter of the hollow microspheres and are formed of glass, ceramic, clay or polymer, and the thermoplastic elastomer in the thermoplastic elastomer resin composition is selected from the group consisting of a thermoplastic polyurethane polymer, an acrylic-based polymer and a polyolefin multiblock copolymer, wherein the protective cover has a dielectric constant which is less than 2.90 at a frequency of 1.8 GHZ, a dielectric constant which is less than 2.70 at a frequency of 10.2 GHz or a dielectric constant which is less than 2.50 at a frequency of 28 GHz and 39 GHz.
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