CPC H03F 1/523 (2013.01) [H01L 27/0288 (2013.01); H01L 27/0629 (2013.01); H01L 29/2003 (2013.01); H01L 29/205 (2013.01); H01L 29/7786 (2013.01); H01L 29/872 (2013.01); H03F 1/0211 (2013.01); H03F 3/195 (2013.01); H03F 2200/06 (2013.01); H03F 2200/294 (2013.01); H03F 2200/426 (2013.01); H03F 2200/451 (2013.01)] | 20 Claims |
1. A monolithic microwave integrated circuit (MMIC) with integrated electrical overstress protection, the MMIC comprising:
a radio frequency (RF) signal pad configured to receive an RF signal; and
an RF circuit coupled to the RF signal pad, the RF circuit comprising a transistor layout, an input field-effect transistor (FET) implemented using a first portion of a plurality of gate fingers of the transistor layout, and an embedded protection device electrically connected between a gate and a source of the input FET and implemented using a second portion of the plurality of gate fingers.
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